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sn54hc377, sn54hc378, sn54hc379 sn74hc377, sn74hc378, sn74hc379 octal, hex, and quad d-type flip-flops with clock enable scls202 d2684, december 1982 revised june 1989 1 post office box 655303 ? dallas, texas 75265 copyright ? 1989, texas instruments incorporated production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
sn54hc377, sn54hc378, sn54hc379 sn74hc377, sn74hc378, sn74hc379 octal, hex, and quad d-type flip-flops with clock enable scls202 d2684, december 1982 revised june 1989 2 post office box 655303 ? dallas, texas 75265
sn54hc377, sn54hc378, sn54hc379 sn74hc377, sn74hc378, sn74hc379 octal, hex, and quad d-type flip-flops with clock enable scls202 d2684, december 1982 revised june 1989 3 post office box 655303 ? dallas, texas 75265
sn54hc377, sn54hc378, sn54hc379 sn74hc377, sn74hc378, sn74hc379 octal, hex, and quad d-type flip-flops with clock enable scls202 d2684, december 1982 revised june 1989 4 post office box 655303 ? dallas, texas 75265
sn54hc377, sn54hc378, sn54hc379 sn74hc377, sn74hc378, sn74hc379 octal, hex, and quad d-type flip-flops with clock enable scls202 d2684, december 1982 revised june 1989 5 post office box 655303 ? dallas, texas 75265
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-87807012a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962-8780701ra active cdip j 20 1 tbd a42 snpb n / a for pkg type sn54hc377j active cdip j 20 1 tbd a42 snpb n / a for pkg type sn74hc377dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377n active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type SN74HC377NE4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74hc377nsr active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc377nsre4 active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc378d obsolete soic d 16 tbd call ti call ti sn74hc378n obsolete pdip n 16 tbd call ti call ti sn74hc378n3 obsolete pdip n 16 tbd call ti call ti sn74hc379n obsolete pdip n 16 tbd call ti call ti snj54hc377fk active lccc fk 20 1 tbd post-plate n / a for pkg type snj54hc377j active cdip j 20 1 tbd a42 snpb n / a for pkg type (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder package option addendum www.ti.com 10-may-2007 addendum-page 1
temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information package materials information www.ti.com 19-may-2007 pack materials-page 1
device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74hc377dwr dw 20 mla 330 24 10.8 13.0 2.7 12 24 q1 sn74hc377nsr ns 20 mla 330 24 8.2 13.0 2.5 12 24 q1 tape and reel box information device package pins site length (mm) width (mm) height (mm) sn74hc377dwr dw 20 mla 333.2 333.2 31.75 sn74hc377nsr ns 20 mla 333.2 333.2 31.75 package materials information www.ti.com 19-may-2007 pack materials-page 2

mechanical data mlcc006b october 1996 post office box 655303 ? dallas, texas 75265 fk (s-cqcc-n**) leadless ceramic chip carrier 4040140 / d 10/96 28 terminal shown b 0.358 (9,09) max (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) a no. of min max 0.358 0.660 0.761 0.458 0.342 (8,69) min (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32) (18,78) ** 20 28 52 44 68 84 0.020 (0,51) terminals 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 12 13 14 15 16 18 17 11 10 8 9 7 5 4 3 2 0.020 (0,51) 0.010 (0,25) 6 1 28 26 27 19 21 b sq a sq 22 23 24 25 20 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. this package can be hermetically sealed with a metal lid. d. the terminals are gold plated. e. falls within jedec ms-004

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration 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are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com telephony www.ti.com/telephony low power www.ti.com/lpw video & imaging www.ti.com/video wireless wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2007, texas instruments incorporated

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